bgasubstrate

ThesubstrateisasmallPCBwithtracesdesignedspecificallyforyourpackage.Thesubstrateisusedforconnectingthebumpstothesolderballsandconsists ...,ASE'ssubstratedesignandmanufacturingcapabilityenablestheinterconnectionmaterialsofawiderangeofwire-bondBGAandflipchipproductapplications.,FC-BGAsubstratesaresemiconductorpackageswithfinedesignruleandhighreliability.KyoceraprovidesICpackageswithmorethan3,000...

參考資訊如下
An Introduction to BGA Package

The substrate is a small PCB with traces designed specifically for your package. The substrate is used for connecting the bumps to the solder balls and consists ...

Packaging Substrate

ASE's substrate design and manufacturing capability enables the interconnection materials of a wide range of wire-bond BGA and flip chip product applications.

Build-up Structure FC-BGA

FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, ...

BGA IC 載板

IC 載板（IC Substrate）架構是指一種用於IC 載板的關鍵特殊基礎材料。

台灣BGA載板(Substrate)產業報告

2000年10月31日 — 由於資訊產品朝向高密度封裝及小型化快速發展，原有表面裝配型的封裝方式，如QFP(Quad Flatpack Package)型式封裝，已不能滿足高腳數IC的封裝需求。

Plastic BGA Substrate | Services

SHINKO supplies organic substrates using prepreg for BGA packages for logic, memory, and sensor devices. 2 layers or 4 layers through-hole substrates are used ...

FC-BGA substrates

FC-BGA substrates. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.

BGA Substrate

2022年11月10日 — A BGA substrate is a carrier that you will use with several versions of BGA packages. Complex devices such as microprocessors require that ...

BGA基板SUBSTRATE｜客戶群

BGA基板SUBSTRATE. 大祥科技股份有限公司DAYSHINE; 日月宏科技股份有限公司ASEM - Kaohsiung; 日月宏科技股份有限公司(中壢) ASEM - Chung-Li; 日月光半導體製造股份 ...